The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Nov. 25, 2015
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Stephen P. Ayotte, Bristol, VT (US);
Glen E. Richard, Burlington, VT (US);
Timothy M. Sullivan, Essex, VT (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/002 (2006.01); H01L 23/00 (2006.01); B23K 1/018 (2006.01); B23K 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/98 (2013.01); B23K 1/002 (2013.01); B23K 1/018 (2013.01); B23K 3/029 (2013.01); H01L 24/799 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75315 (2013.01); H01L 2224/75745 (2013.01);
Abstract
Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.