The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Apr. 22, 2016
Applicant:
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Inventors:
Nobuhisa Onai, Ota, JP;
Takayuki Taguchi, Hanyu, JP;
Assignee:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/04 (2006.01); B25B 11/00 (2006.01); H01L 23/00 (2006.01); B23K 20/00 (2006.01); B23K 20/233 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/78 (2013.01); B23K 20/004 (2013.01); B23K 20/233 (2013.01); B23K 20/2333 (2013.01); B23K 37/0443 (2013.01); H01L 24/85 (2013.01); B23K 2201/42 (2013.01); B25B 11/005 (2013.01); H01L 2224/78744 (2013.01); H01L 2224/78842 (2013.01); H01L 2224/78983 (2013.01); H01L 2224/8515 (2013.01); H01L 2224/85205 (2013.01);
Abstract
Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.