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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10050005 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Nov. 25, 2014

Semiconductor resin composition, semiconductor resin film, and semiconductor device using the same

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Daisuke Kanamori, Otsu, JP;

Takuro Oda, Otsu, JP;

Toshihisa Nonaka, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Jeffrey C Mullis

Int. Cl.
CPC ...
C09J 163/00 (2006.01); H01L 23/00 (2006.01); C08L 21/00 (2006.01); H01L 21/683 (2006.01); C09D 179/08 (2006.01); C08G 73/10 (2006.01); C09J 179/08 (2006.01); C09J 9/02 (2006.01); C09J 7/20 (2018.01); C08K 3/36 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C08G 73/106 (2013.01); C08G 73/1017 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08G 73/1064 (2013.01); C08G 73/1071 (2013.01); C08G 73/1082 (2013.01); C08K 3/36 (2013.01); C08L 21/00 (2013.01); C08L 63/00 (2013.01); C09D 179/08 (2013.01); C09J 7/20 (2018.01); C09J 9/02 (2013.01); C09J 163/00 (2013.01); C09J 179/08 (2013.01); H01L 21/6836 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2463/00 (2013.01); C09J 2479/00 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/2929 (2013.01);
Abstract

The objective of the present invention is to obtain a semiconductor resin composition having a sufficiently low coefficient of linear expansion of the cured product thereof and a uniform distribution of inorganic particles in the direction of film thickness of a produced semi-cured film thereof. The semiconductor resin composition, which contains (a) an epoxy compound, (b) inorganic particles, (c) a polyimide, and (d) a solvent, is characterized by further containing (e) rubber particles and by the fraction of the (b) inorganic particles in the weight of the total solid fraction resulting from subtracting the weight of the (d) solvent from the total weight of the semiconductor resin composition being 60-92 wt % inclusive.

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