The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Jun. 28, 2017
Kabushiki Kaisha Toyota Jidoshokki, Aichi-ken, JP;
Naoki Kato, Kariya, JP;
Shogo Mori, Kariya, JP;
Harumitsu Sato, Kariya, JP;
Hiroki Watanabe, Kariya, JP;
Hiroshi Yuguchi, Kariya, JP;
Koji Nishimura, Kariya, JP;
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, Aichi-Ken, JP;
Abstract
A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.