The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Jun. 16, 2016
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 25/16 (2006.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A method of producing an optoelectronic component includes providing a lead frame having an upper side including a contact region and a chip reception region raised relative to the contact region; arranging an electrically conductive element on the contact region; embedding the lead frame in a molded body, wherein the contact region is covered by the molded body, and the chip reception region and the electrically conductive element remain accessible on an upper side of the molded body; arranging an optoelectronic semiconductor chip on the chip reception region; and connecting the optoelectronic semiconductor chip and the electrically conductive element by a bonding wire.