The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Nov. 18, 2016
Applicant:
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventor:
Alberto Arrigoni, Eupilio, IT;
Assignee:
STMicroelectronics S.r.l., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49506 (2013.01); H01L 21/4825 (2013.01); H01L 23/4985 (2013.01); H01L 23/49524 (2013.01); H01L 23/49527 (2013.01); H01L 23/49548 (2013.01); H01L 23/49805 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/14505 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/8182 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81207 (2013.01); H01L 2924/14 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A semiconductor device includes a leadframe that includes contact pins and a semiconductor die that has protruding connection formations. A flexible support member is disposed between the leadframe and the semiconductor die and supports the semiconductor die. The flexible support member has electrically conductive lines that extend between the leadframe and the semiconductor die. The electrically conductive lines of the flexible support member are electrically coupled with the contact pins of the leadframe and with the connection formations of the semiconductor die.