The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Jan. 06, 2014
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Ryoji Murai, Fukuoka, JP;
Shintaro Araki, Tokyo, JP;
Takaaki Shirasawa, Tokyo, JP;
Korehide Okamoto, Fukuoka, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/24 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3736 (2013.01); H01L 23/24 (2013.01); H01L 23/367 (2013.01); H01L 23/36 (2013.01); H01L 23/3737 (2013.01); H01L 2924/0002 (2013.01);
Abstract
According to the present invention, a grease layer having a grease as a constituent material is provided in a filling region lying between a heat dissipation surface that is a bottom surface of a heat dissipation material of a semiconductor module and a surface of a cooler. Further, a seal material is formed on the surface of the cooler and covers the entire side surface region of the grease layer without any gap. The seal material has a liquid curable sealing agent as a constituent material.