The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Aug. 30, 2012
Applicants:

Kevin Ptasienski, O'Fallon, MO (US);

Allen Norman Boldt, Kirkwood, MO (US);

Janet Lea Smith, Columbia, MO (US);

Cal Thomas Swanson, St. Louis, MO (US);

Mohammad Nosrati, Fenton, MO (US);

Kevin Robert Smith, Columbia, MO (US);

Inventors:

Kevin Ptasienski, O'Fallon, MO (US);

Allen Norman Boldt, Kirkwood, MO (US);

Janet Lea Smith, Columbia, MO (US);

Cal Thomas Swanson, St. Louis, MO (US);

Mohammad Nosrati, Fenton, MO (US);

Kevin Robert Smith, Columbia, MO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 13/00 (2006.01); B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); H01L 21/67 (2006.01); H05B 3/20 (2006.01); H05B 1/02 (2006.01); H05B 1/00 (2006.01); H05B 3/02 (2006.01); H01L 21/683 (2006.01); H05B 3/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01L 21/67098 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/6833 (2013.01); H05B 1/00 (2013.01); H05B 1/02 (2013.01); H05B 1/0202 (2013.01); H05B 1/0227 (2013.01); H05B 1/0233 (2013.01); H05B 3/02 (2013.01); H05B 3/06 (2013.01); H05B 3/20 (2013.01); H05B 2203/005 (2013.01); H05B 2203/013 (2013.01); H05B 2213/03 (2013.01); Y10T 156/10 (2015.01);
Abstract

Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.


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