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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10048583 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Aug. 23, 2017

Method for manufacturing conductive pattern forming member

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Tsukuru Mizuguchi, Otsu, JP;

Tomotaka Kawano, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch LLP

Primary Examiner:

John A McPherson

Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/004 (2006.01); C08F 220/12 (2006.01); C08F 220/06 (2006.01); C08F 222/20 (2006.01); G03F 7/11 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/26 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0047 (2013.01); C08F 220/06 (2013.01); C08F 220/12 (2013.01); C08F 222/20 (2013.01); G03F 7/038 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); G06F 3/044 (2013.01); G06F 2203/04103 (2013.01);
Abstract

Provided is a method for manufacturing a conductive pattern forming member that is formed on a substrate and that has excellent resistance to ion migration between a conductive pattern and a photosensitive resin layer, while suppressing generation of residues in the dissolution and removal of unexposed portions. This method for manufacturing a conductive pattern forming member includes: a coating step of applying, onto surfaces of a layer A formed of a resin (a) having a carboxyl group, and a transparent electrode layer B, the layers A and B being formed over a substrate, a composition C containing conductive particles and a resin (c) having a double bond and a carboxyl group to obtain a coating film C; a drying step of drying the coating film C to obtain a dry film C; an exposure step of exposing the dry film C to light to obtain an exposed film C; a developing step of developing the exposed film C to obtain a pattern C; and a curing step of curing the pattern C to obtain a conductive pattern C, wherein particles having a particle diameter of 0.3 to 2.0 μm account for 80% or more of the conductive particles.

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