The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Aug. 18, 2014
Applicant:

Hyundai Motor Company, Seoul, KR;

Inventors:

Il Seon Yoo, Seoul, KR;

Hi Won Lee, Seoul, KR;

Soon Myung Kwon, Seoul, KR;

Hyun Soo Kim, Seoul, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 21/66 (2006.01); G01P 3/42 (2006.01); B81C 1/00 (2006.01); G01P 15/08 (2006.01); G01C 19/5783 (2012.01);
U.S. Cl.
CPC ...
G01P 3/42 (2013.01); B81C 1/00269 (2013.01); G01C 19/5783 (2013.01); G01P 15/0802 (2013.01); B81C 2203/0118 (2013.01);
Abstract

A MEMS sensor and a manufacturing method thereof is provided: forming a lower electrode layer wherein a metal is deposited on a portion of a lower glass substrate; forming a structural layer by etching according to a pattern which is formed on an upper surface of a silicon wafer and then further etching to the same thickness as the metal which is formed on a portion of the lower electrode layer; anodic bonding the structural layer to an upper portion of the lower electrode layer formed; forming a sensing part in the structural layer by etching according to a pattern which is formed on an opposite surface of the structural layer which is not etched; and forming an upper electrode layer by depositing a metal on an upper wafer and eutectic bonding the upper electrode layer to the structural layer on which the sensing part is formed.


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