The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Mar. 17, 2016
Applicant:

Bio-rad Laboratories, Inc, Hercules, CA (US);

Inventor:

Jan zur Megede, Hercules, CA (US);

Assignee:

Bio-Rad Laboratories, Inc., Hercules, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/543 (2006.01); B01L 3/00 (2006.01); B01L 3/02 (2006.01);
U.S. Cl.
CPC ...
G01N 33/54306 (2013.01); B01L 3/0241 (2013.01); B01L 3/5027 (2013.01); B01L 3/5088 (2013.01); B01L 2300/0861 (2013.01);
Abstract

Sample analysis systems and methods are provided. In one embodiment, the method may be achieved by applying a substance to a surface of a substrate having a first binding agent immobilized thereon; removing unbound material from at least a portion of the substrate having the substance applied thereon; applying a second binding agent to the surface of the substrate, wherein the second binding agent is optically labeled or unlabeled; removing unbound material from at least a portion of the substrate having the second binding agent applied thereon; responsive to detecting the optically labeled second binding agent bound to the substance, identifying the analyte present in the sample; and responsive to not detecting the optically labeled second binding agent bound to the substance, determining that the analyte is absent in the sample; wherein the applying the substance or second binding agent to the surface of the substrate steps are concurrent with the respective removing unbound material from at least a portion of the substrate steps. Systems and other methods are also described and illustrated.


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