The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

May. 08, 2015
Applicant:

Quartzdyne, Inc., Salt Lake City, UT (US);

Inventors:

Derek W. Puccio, Murray, UT (US);

Errol P. EerNisse, Salt Lake City, UT (US);

Assignee:

Quartzdyne, Inc., Salt Lake City, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/113 (2006.01); G01L 9/00 (2006.01); G01L 1/16 (2006.01); H01L 41/18 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0022 (2013.01); G01L 1/162 (2013.01); G01L 9/0016 (2013.01); H01L 41/1132 (2013.01); H01L 41/18 (2013.01); Y10T 29/42 (2015.01); Y10T 29/4902 (2015.01); Y10T 29/49005 (2015.01); Y10T 29/4908 (2015.01);
Abstract

Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.


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