The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Mar. 21, 2012
Applicants:

Takaya Suzuki, Shizuoka, JP;

Toyoaki Ishiwata, Shizuoka, JP;

Yoshinori Suzuki, Shizuoka, JP;

Hiroshi Numata, Shizuoka, JP;

Inventors:

Takaya Suzuki, Shizuoka, JP;

Toyoaki Ishiwata, Shizuoka, JP;

Yoshinori Suzuki, Shizuoka, JP;

Hiroshi Numata, Shizuoka, JP;

Assignee:

TOHO TENAX CO., LTD, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D06M 15/55 (2006.01); B29D 7/01 (2006.01); C08J 5/24 (2006.01); C08G 59/50 (2006.01); C08L 63/00 (2006.01); B29C 70/50 (2006.01);
U.S. Cl.
CPC ...
D06M 15/55 (2013.01); B29C 70/504 (2013.01); B29D 7/01 (2013.01); C08G 59/5033 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08J 2363/00 (2013.01); Y10T 442/2049 (2015.04);
Abstract

The present invention provides a prepreg comprising: a primary pre-pregnant made of a reinforced fiber substrate and an epoxy resin composition containing at least epoxy resin and thermoplastic resin impregnated into the reinforcing fiber that forms the reinforced fiber substrate; and a surface layer made of epoxy resin composition containing at least an epoxy resin and an epoxy resin-soluble thermoplastic resin that dissolves in the epoxy resin, the surface layer being formed on one or both surfaces of the primary prepreg; the prepreg being characterized in that only one of either the epoxy resin composition of the primary prepreg or the epoxy resin composition of the surface layer contains a hardening agent for an epoxy resin.


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