IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10047441 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Oct. 26, 2017

Substrate processing apparatus and substrate processing method

Applicant:

Screen Semiconductor Solutions Co., Ltd., Kyoto, JP;

Inventors:

Masahiko Harumoto, Kyoto, JP;

Tadashi Miyagi, Kyoto, JP;

Yukihiko Inagaki, Kyoto, JP;

Koji Kaneyama, Kyoto, JP;

Assignee:

SCREEN Semiconductor Solutions Co., Ltd., , JP;

Attorney:

Ostrolenk Faber LLP

Primary Examiner:

Rodney Fuller

Int. Cl.
CPC ...
G03D 5/00 (2006.01); C23C 16/56 (2006.01); H01J 37/02 (2006.01); B05C 11/00 (2006.01); H01L 21/033 (2006.01); G03F 7/32 (2006.01); G03F 7/20 (2006.01); C23C 16/02 (2006.01); G03F 7/30 (2006.01); G03F 7/16 (2006.01); G03F 7/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/56 (2013.01); B05C 11/00 (2013.01); C23C 16/0227 (2013.01); G03F 7/0002 (2013.01); G03F 7/162 (2013.01); G03F 7/20 (2013.01); G03F 7/3021 (2013.01); G03F 7/32 (2013.01); H01J 37/02 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/6715 (2013.01); H01L 21/67115 (2013.01); H01L 21/67126 (2013.01); H01L 21/67178 (2013.01);
Abstract

An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.

Find Patent Forward Citations

Loading…