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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10047257 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Sep. 25, 2014

Adhesive agent composition for multilayer semiconductor

Applicant:

Daicel Corporation, Osaka-shi, Osaka, JP;

Inventors:

Hiroki Tanaka, Himeji, JP;

Katsuhiro Nakaguchi, Himeji, JP;

Kiyoharu Tsutsumi, Himeji, JP;

Yousuke Ito, Himeji, JP;

Naoko Tsuji, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka-Shi, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Charles Garber

Assistant Examiner:

Abdulfattah Mustapha

Int. Cl.
CPC ...
H01L 21/00 (2006.01); C09J 163/00 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); C08G 59/68 (2006.01); C09J 7/35 (2018.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/68 (2013.01); C09J 7/35 (2018.01); H01L 24/83 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); C09J 2203/326 (2013.01); C09J 2463/00 (2013.01); H01L 23/293 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

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