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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10047256 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Mar. 04, 2014

Epoxy resin composition, cured product, heat radiating material, and electronic member

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yasuyo Yoshimoto, Sakura, JP;

Atsushi Oshio, Sakura, JP;

Kunihiro Morinaga, Ichihara, JP;

Hiroshi Kinoshita, Sakura, JP;

Daisuke Ito, Sakura, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Kregg T Brooks

Int. Cl.
CPC ...
C08G 59/06 (2006.01); C08G 59/32 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 9/00 (2006.01); C08K 3/00 (2018.01); C08K 3/10 (2018.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C09K 5/14 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H05K 1/03 (2006.01); H05K 7/20 (2006.01); C08K 7/18 (2006.01); C08K 9/06 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/32 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C09J 9/00 (2013.01); C09J 11/04 (2013.01); C09K 5/14 (2013.01); H01L 23/293 (2013.01); H05K 1/0373 (2013.01); C08K 7/18 (2013.01); C08K 9/06 (2013.01); H01L 23/295 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention provides an epoxy resin composition including 2,2',7,7′-tetraglycidyloxy-1,1′-binaphthalene as an epoxy resin (A), and a filler (B). Further, the present invention provides an epoxy resin composition in which the filler (B) in the epoxy resin composition is a thermally conductive filler and an epoxy resin composition in which the filler (B) is silica. Further, the present invention provides a cured product produced by curing the epoxy resin composition of the present invention and a heat dissipation material and an electronic material each including the cured product.

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