The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Oct. 28, 2015
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takenori Kakutani, Saitama, JP;

Takao Miwa, Saitama, JP;

Hirofumi Ono, Tokyo, JP;

Yamato Saito, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/06 (2006.01); B32B 27/06 (2006.01); B32B 27/28 (2006.01); C08J 5/24 (2006.01); B32B 5/26 (2006.01); B32B 27/38 (2006.01); B32B 27/32 (2006.01); H05K 1/03 (2006.01); C08J 5/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/06 (2013.01); B32B 5/26 (2013.01); B32B 27/06 (2013.01); B32B 27/285 (2013.01); B32B 27/32 (2013.01); B32B 27/38 (2013.01); C08J 5/005 (2013.01); C08J 5/24 (2013.01); H05K 1/038 (2013.01); H05K 1/0366 (2013.01); B32B 2262/062 (2013.01); B32B 2457/08 (2013.01); C08J 2301/02 (2013.01); C08J 2363/00 (2013.01); C08J 2379/08 (2013.01); H05K 2201/0195 (2013.01);
Abstract

Provided are: a resin-containing sheet in which not only the mechanical strength of a cellulose nanofiber nonwoven fabric but also the flexural resistance of a substrate are improved; and a structure and a wiring board which include the same. The resin-containing sheet includes: a specific cellulose nanofiber nonwoven fabric (); a fixing agent () which fixes together fibers () in the cellulose nanofiber nonwoven fabric (); and a resin () which is in contact with the cellulose nanofiber nonwoven fabric () and the fixing agent (), wherein the storage modulus of the fixing agent () is higher than that of the resin (). The structure is obtained by tightly adhering the resin-containing sheet to a substrate. The wiring board includes this structure.


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