The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Aug. 27, 2015
Dic Corporation, Tokyo, JP;
Kunihiro Morinaga, Chiba, JP;
Makoto Kimura, Chiba, JP;
Koji Hayashi, Chiba, JP;
Takamitsu Nakamura, Osaka, JP;
DIC CORPORATION, Tokyo, JP;
Abstract
Provided are a curable resin composition capable of providing excellent heat resistance and toughness for a cured product, in which these physical properties are less deteriorated even in a case of being exposed to humidity and heat conditions, and a cured product, a fiber reinforced composite material, and a molded article thereof. The curable resin composition includes an epoxy resin and a curing agent, in which the epoxy resin is an epoxy resin obtained by the polyglycidyl-etherification of a phenol novolac resin. The phenol novolac resin contains bisphenol F having different binding sites, and in the bisphenol F components, the content of the [o, p'] conjugate is in a range of 30% to 45% relative to the total of the [o, p′] conjugate+the [o, o′] conjugate+the [p, p′] conjugate in terms of the area ratio according to a liquid chromatography measurement.