The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Sep. 18, 2015
Applicant:
Boe Technology Group Co., Ltd, Beijing, CN;
Inventors:
Lu Liu, Beijing, CN;
Ming Che Hsieh, Beijing, CN;
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); B32B 37/14 (2006.01); B32B 38/10 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
B32B 38/10 (2013.01); B32B 27/281 (2013.01); B32B 37/14 (2013.01); H01L 51/003 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2457/206 (2013.01); H01L 27/3244 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01);
Abstract
A method for fabricating a flexible device is provided. The method includes forming a sacrificial layer on a substrate; and forming a reflective layer to reflect a laser for subsequently de-bonding the sacrificial layer from the rigid substrate back to the sacrificial layer to reduce required de-bonding energy of the laser over at least a portion of the rigid substrate. Further, the method includes forming a flexible device over the reflective layer; and separating the substrate from the sacrificial layer by irradiating the sacrificial layer using the laser.