The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Mar. 07, 2016
Applicant:
Fuji Jukogyo Kabushiki Kaisha, Tokyo, JP;
Inventor:
Tsubasa Ono, Tokyo, JP;
Assignee:
SUBARU CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/30 (2006.01); B29C 65/02 (2006.01); B29C 65/00 (2006.01); B29C 65/08 (2006.01); B32B 3/26 (2006.01);
U.S. Cl.
CPC ...
B29C 66/30221 (2013.01); B29C 65/08 (2013.01); B29C 66/1122 (2013.01); B29C 66/21 (2013.01); B29C 66/43 (2013.01); B29C 66/7392 (2013.01); B29C 66/8322 (2013.01); B32B 3/26 (2013.01); B32B 3/30 (2013.01); B29C 66/71 (2013.01); B29C 66/721 (2013.01); B29C 66/7212 (2013.01); Y10T 428/2457 (2015.01); Y10T 428/24355 (2015.01); Y10T 428/24612 (2015.01);
Abstract
A resin member contains a thermoplastic resin and is bonded to another resin member by ultrasonic welding. The resin member includes projections that are projected from a surface of a bonding target section of the resin member and melted by application of contact pressure during the ultrasonic welding. The projections include projections having different projection heights from the surface of the bonding target section.