The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Sep. 25, 2015
Hitachi Metals, Ltd., Tokyo, JP;
Yukio Ikeda, Hitachi, JP;
HITACHI METALS, LTD., Tokyo, JP;
Abstract
A method for producing a cable with a resin mold including a cable section comprising an electric wire and a sheath comprising a synthetic resin covering the electric wire, and a resin mold section into which a portion of the sheath is molded by a resin is provided. A portion of the cable section is received in a receiving space in a die formed with a molten resin inlet, an inflow passage, and a resin reservoir therein. A molten resin is injected from the inlet into the receiving space. A portion of the injected molten resin flows through the inflow passage and is retained in the resin reservoir. The portion of the sheath is molten by heat of the molten resin. The molten resin is solidified to thereby form a molded resin product. Its unnecessary portion solidified in the resin reservoir is removed from the molded resin product.