The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

May. 28, 2015
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Barbara Behr, Abensberg, DE;

Andreas Ploessl, Regensburg, DE;

Mathias Wendt, Hausen, DE;

Marcus Zenger, Hausen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); B23K 1/00 (2006.01); F27D 3/00 (2006.01); B32B 15/01 (2006.01); B32B 9/00 (2006.01); B32B 7/04 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/32 (2006.01); C22C 5/02 (2006.01); C22C 13/00 (2006.01); C22C 5/04 (2006.01); C22C 28/00 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/0006 (2013.01); B23K 35/26 (2013.01); B23K 35/3013 (2013.01); B23K 35/322 (2013.01); B32B 7/04 (2013.01); B32B 9/002 (2013.01); B32B 9/005 (2013.01); B32B 15/01 (2013.01); B32B 15/018 (2013.01); C22C 5/02 (2013.01); C22C 5/04 (2013.01); C22C 13/00 (2013.01); C22C 28/00 (2013.01); F27D 3/00 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/0079 (2013.01); B32B 2457/00 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/29099 (2013.01); H01L 2224/83825 (2013.01);
Abstract

A device is specified, said device comprising a first component (), a second component (), and a connecting component () comprising at least a first region () and at least a second region (). The composition of the first region () differs from the composition of the second region (). The connecting component () is arranged between the first component () and the second component (). The connecting component () comprises different kinds of metals, the first region () of the connecting component () comprises a first metal (), and the concentration of the first metal () is greater in the first region () than the concentration of the first metal () in the second region ().


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