The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Apr. 21, 2015
Applicants:

University of South Florida, Tampa, FL (US);

George Mason University, Fairfax, VA (US);

Inventors:

Christopher Leroy Frewin, Tampa, FL (US);

Joseph Jonathan Register, Tampa, FL (US);

Stephen E. Saddow, Odessa, FL (US);

Meralys Reyes-Natal, Tampa, FL (US);

Joseph J. Pancrazio, Boyds, MD (US);

Assignee:

UNIVERSITY OF SOUTH FLORIDA, Tampa, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61B 5/00 (2006.01); A61B 5/04 (2006.01); A61B 5/055 (2006.01); A61N 1/05 (2006.01);
U.S. Cl.
CPC ...
A61N 1/375 (2013.01); A61B 5/04001 (2013.01); A61B 5/055 (2013.01); A61B 5/6868 (2013.01); A61N 1/0534 (2013.01);
Abstract

An implantable magnetic resonant imaging (MRI) safe stylus for biomedical devices is described. In one example, the stylus includes a set of stylus modules. One or more of the stylus modules includes a core rod formed of silicon carbide (SiC) material, a recording array mounted on the core rod, and a stimulation array mounted at a distal end of the core rod. The stylus also includes a hemispherical cap formed of SiC material. In part due to the construction and choice of materials used in the stylus, it does not substantially couple with electromagnetic fields during an MRI, for example. Therefore, the stylus does not produce excessive additional heat. The designs described herein also rely on the high thermal transport but low heat capacity of SiC to provide a thermal pathway which will conduct induced heat throughout the stylus, to dissipate heat more evenly.


Find Patent Forward Citations

Loading…