The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Jan. 06, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jae-Ean Lee, Busan, KR;
Jee-Soo Mok, Yongin-si, KR;
Young-Gwan Ko, Seoul, KR;
Kyung-Hwan Ko, Gimhae, KR;
Yong-Ho Baek, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/46 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4697 (2013.01); H05K 1/183 (2013.01); H05K 3/4038 (2013.01); H05K 1/113 (2013.01); H05K 1/115 (2013.01); H05K 1/185 (2013.01); H05K 3/0011 (2013.01); H05K 3/3436 (2013.01); H05K 3/4007 (2013.01); H05K 2201/10 (2013.01);
Abstract
A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.