The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Nov. 08, 2016
International Business Machines Corporation, Armonk, NY (US);
Sarah K. Czaplewski, Rochester, MN (US);
Joseph Kuczynski, North Port, FL (US);
Kevin M. O'Connell, Rochester, MN (US);
Chelsie M. Peterson, Dexter, MN (US);
Mark D. Plucinski, Toms River, NJ (US);
Timothy J. Tofil, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.