The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Nov. 11, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Suk Hyeon Cho, Suwon-si, KR;
Hyo Seung Nam, Hwasung-si, KR;
Yong Sam Lee, Yongin-si, KR;
Seok Hwan Ahn, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/42 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 24/97 (2013.01); H05K 3/0052 (2013.01); H05K 3/429 (2013.01); H05K 3/4605 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H05K 3/002 (2013.01); H05K 3/007 (2013.01); H05K 3/0029 (2013.01); H05K 3/0047 (2013.01); H05K 3/4644 (2013.01); H05K 2201/017 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09881 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/1536 (2013.01);
Abstract
A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.