The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Jan. 06, 2017
Applicant:
Fujikura Ltd., Koto-ku, Tokyo, JP;
Inventor:
Shinji Fujita, Sakura, JP;
Assignee:
FUJIKURA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); H02G 1/00 (2006.01); B23K 20/00 (2006.01); H01R 4/68 (2006.01); B23K 1/00 (2006.01); B23K 3/04 (2006.01); B23K 3/08 (2006.01); B23K 37/04 (2006.01); H01B 12/00 (2006.01); H01R 43/02 (2006.01); H01R 4/02 (2006.01); B23K 1/19 (2006.01); H01B 12/04 (2006.01); B23K 101/32 (2006.01);
U.S. Cl.
CPC ...
H02G 1/005 (2013.01); B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 3/04 (2013.01); B23K 3/085 (2013.01); B23K 3/087 (2013.01); B23K 20/004 (2013.01); B23K 37/0408 (2013.01); H01B 12/00 (2013.01); H01B 12/04 (2013.01); H01R 4/022 (2013.01); H01R 4/027 (2013.01); H01R 4/68 (2013.01); H01R 43/02 (2013.01); H01R 43/0263 (2013.01); B23K 2201/32 (2013.01);
Abstract
A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.