The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Feb. 14, 2017
Applicant:
Yamaichi Electronics Co., Ltd., Tokyo, JP;
Inventors:
Hideki Sagano, Kawasaki, JP;
Hideki Sato, Chiba, JP;
Assignee:
YAMAICHI ELECTRONICS CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/193 (2006.01); H01R 12/89 (2011.01); G01R 1/04 (2006.01); H01L 23/32 (2006.01); H01L 23/00 (2006.01); H01R 13/24 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
H01R 12/89 (2013.01); G01R 1/0466 (2013.01); H01L 23/32 (2013.01); H01L 24/14 (2013.01); H01L 24/72 (2013.01); H01R 13/2464 (2013.01); H01R 13/2485 (2013.01); H01R 13/2492 (2013.01); H05K 7/1069 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/14131 (2013.01); H01R 13/193 (2013.01); H01R 2201/20 (2013.01);
Abstract
In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.