The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Oct. 21, 2016
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Yujian Cheng, Chengdu, CN;

Yi Chen, Chengdu, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 13/02 (2006.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01Q 13/10 (2006.01); H01Q 1/42 (2006.01); H01Q 21/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/02 (2013.01); H01Q 1/38 (2013.01); H01Q 1/422 (2013.01); H01Q 9/045 (2013.01); H01Q 13/106 (2013.01); H01Q 21/24 (2013.01);
Abstract

Embodiments of the present invention provide a multi-polarization substrate integrated waveguide antenna. In the multi-polarization substrate integrated waveguide antenna of the present invention, the antenna is of a multi-layer structure and includes a first metal copper clad layer, a first dielectric layer, a second metal copper, clad layer, a second dielectric layer, and a third metal copper clad layer successively from top to bottom, where plated through holes are provided on both the first dielectric layer and the second dielectric layer, and etching grooves are provided on both the first metal copper clad layer and the second metal copper clad layer. The embodiments of the present invention resolve a problem that feeding efficiency is reduced in a high frequency application when a microstrip is used to feed electricity.


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