The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Oct. 30, 2015
Applicant:

Zeon Corporation, Chiyoda-ku, Tokyo, JP;

Inventors:

Kenya Sonobe, Tokyo, JP;

Yasuhiro Isshiki, Tokyo, JP;

Masanori Shibuya, Tokyo, JP;

Assignee:

ZEON CORPORATION, Chiyoda-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/133 (2010.01); C08F 220/56 (2006.01); C08F 220/06 (2006.01); C09D 5/24 (2006.01); C09D 133/02 (2006.01); C09D 133/26 (2006.01); H01M 4/131 (2010.01); H01M 4/36 (2006.01); H01M 4/525 (2010.01); H01M 4/48 (2010.01); H01M 4/587 (2010.01); H01M 4/62 (2006.01); H01M 4/66 (2006.01); H01M 10/0525 (2010.01); H01M 10/0587 (2010.01); H01M 2/16 (2006.01); H01M 10/0568 (2010.01); H01M 10/0569 (2010.01); H01M 10/0567 (2010.01); C08K 3/34 (2006.01); C08K 3/04 (2006.01); H01M 4/02 (2006.01); H01M 4/04 (2006.01); H01M 4/1393 (2010.01);
U.S. Cl.
CPC ...
H01M 4/133 (2013.01); C08F 220/06 (2013.01); C08F 220/56 (2013.01); C09D 5/24 (2013.01); C09D 133/02 (2013.01); C09D 133/26 (2013.01); H01M 2/1653 (2013.01); H01M 4/131 (2013.01); H01M 4/364 (2013.01); H01M 4/483 (2013.01); H01M 4/525 (2013.01); H01M 4/587 (2013.01); H01M 4/623 (2013.01); H01M 4/625 (2013.01); H01M 4/661 (2013.01); H01M 10/0525 (2013.01); H01M 10/0567 (2013.01); H01M 10/0568 (2013.01); H01M 10/0569 (2013.01); H01M 10/0587 (2013.01); C08K 3/04 (2013.01); C08K 3/34 (2013.01); C08K 2201/001 (2013.01); H01M 4/0404 (2013.01); H01M 4/0435 (2013.01); H01M 4/0471 (2013.01); H01M 4/1393 (2013.01); H01M 2004/027 (2013.01); H01M 2004/028 (2013.01); H01M 2300/0037 (2013.01);
Abstract

A material for slurry composition-use for example is a paste composition including a negative electrode active material that contains a silicon-based negative electrode active material in an amount of at least 30 mass % and a water-soluble polymer in an amount of at least 3 parts by mass and less than 500 parts by mass per 100 parts by mass of the silicon-based negative electrode active material. The water-soluble polymer includes at least 20.0 mass % and no greater than 79.5 mass % of structural units derived from an ethylenically unsaturated carboxylic acid compound (A) and at least 20.0 mass % and no greater than 79.5 mass % of structural units derived from a copolymerizable compound (B) that has an ethylenically unsaturated bond and a water solubility of at least 7 g/100 g at 20° C., and the water-soluble polymer has a degree of swelling in electrolysis solution of less than 120%.


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