The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Mar. 18, 2016
Applicant:

Xiamen Changelight Co., Ltd., Xiamen, CN;

Inventors:

Zhiwei Lin, Xiamen, CN;

Kaixuan Chen, Xiamen, CN;

Yong Zhang, Xiamen, CN;

Xiangjing Zhuo, Xiamen, CN;

Wei Jiang, Xiamen, CN;

Tianzu Fang, Xiamen, CN;

Yinqiao Zhang, Xiamen, CN;

Xiangwu Wang, Xiamen, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/42 (2010.01); H01L 33/30 (2010.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 25/075 (2006.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 27/153 (2013.01); H01L 25/0756 (2013.01); H01L 33/0062 (2013.01); H01L 33/0075 (2013.01); H01L 33/32 (2013.01); H01L 33/30 (2013.01); H01L 33/382 (2013.01); H01L 33/42 (2013.01); H01L 2933/0016 (2013.01);
Abstract

An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.


Find Patent Forward Citations

Loading…