The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Apr. 21, 2016
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Nobuo Sakai, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H05B 33/08 (2006.01); H01L 23/525 (2006.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/5252 (2013.01); H01L 27/0248 (2013.01); H01L 27/0255 (2013.01); H01L 29/866 (2013.01); H01L 33/62 (2013.01); H05B 33/089 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); Y02B 20/341 (2013.01);
Abstract

A Zener diode used as an ESD protection element is connected in parallel to a circuit to be protected, for example an LED chip. The Zener diode is connected in parallel to an antifuse element. For example, an LED package (P-Pn) includes the LED chip and a composite protection element connected in parallel thereto. The composite protection element includes the Zener diode and antifuse element. The Zener diode is formed in a semiconductor substrate, and the antifuse element is formed in a wiring layer on the semiconductor substrate.


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Sakai, Nobuo. (2018). Composite protection circuit, composite protection element, and led device for illumination (U.S. Patent No. 10043786). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10043786

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