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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10043775 B1

PDFFull Text
Date of Patent:
Aug. 07, 2018

Filed:

Dec. 26, 2014

Bonding material, bonding method and semiconductor device for electric power

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventor:

Koji Yamazaki, Chiyoda-ku, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Elias M Ullah

Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 23/00 (2006.01); B23K 35/30 (2006.01); B23K 20/00 (2006.01); C22C 5/06 (2006.01); C22C 12/00 (2006.01); C22C 13/00 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H05K 3/34 (2006.01); B23K 20/02 (2006.01); B23K 35/02 (2006.01); C22F 1/14 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); B23K 20/00 (2013.01); B23K 20/026 (2013.01); B23K 35/0233 (2013.01); B23K 35/30 (2013.01); B23K 35/3006 (2013.01); C22C 5/06 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); C22F 1/14 (2013.01); H01L 23/3735 (2013.01); H01L 23/4334 (2013.01); H01L 23/49513 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 24/83 (2013.01); H01L 29/1602 (2013.01); H01L 29/2003 (2013.01); H05K 3/3463 (2013.01); B23K 2201/40 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/8383 (2013.01); H01L 2224/83101 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01083 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01);
Abstract

The present invention has an object to achieve bonding which satisfies both in heat resistivity and in stress-relaxation ability, and the bonding material according to this invention is a sheet-like bonding materialmade of a silver-bismuth alloy which, when heated in a state being in contact with a metal material as a bonding target (for example, surface layers), forms in the metal material (as its material, for example, gold, silver or copper) a diffusion layer Ld, Ldof silver due to solid-phase diffusion reaction, so as to be bonded to the metal material, said bonding material being characterized by containing not less than 1 mass % but not more than 5 mass % of bismuth.

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