The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Oct. 02, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Cyril Cabral, Jr., Yorktown Heights, NY (US);

Kenneth P. Rodbell, Sandy Hook, CT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/24 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); H01L 21/76892 (2013.01); H01L 27/2463 (2013.01);
Abstract

An integrated circuit structure and formation thereof. The integrated circuit structure includes a substrate and a front-end-of-the-line (FEOL) portion. The FEOL portion rests on top of and in contact with the substrate. The integrated circuit structure includes a memory level portion. The memory level portion rests on top of and in contact with the FEOL portion. The integrated circuit structure includes a back-end-of-the-line (BEOL) portion. The BEOL portion rests on top of and in contact with the memory level portion. The integrated circuit structure includes a multiple layer that includes one or more pairs of reactive materials. The multiple layer is one or more of: i) on top of the BEOL portion; ii) within the BEOL portion; iii) within the memory level portion; iv) within the FEOL portion; v) embedded in the substrate; and vi) on bottom of a thinned substrate.


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