The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Sep. 08, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Toshiya Tadakuma, Tokyo, JP;
Toma Takao, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device includes a plurality of semiconductor elements including a power semiconductor element, a lead frame including one main surface on which the plurality of semiconductor elements are mounted, a resin that seals the plurality of semiconductor elements and a part of the lead frame where the plurality of semiconductor elements are mounted, and at least one shield member disposed above the plurality of semiconductor elements on a side of the one main surface of the lead frame. The shield member is held by the resin, and the shield member has a higher magnetic permeability or a higher electrical conductivity than the resin.