The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Jun. 15, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Ravi Joshi, Villach, AT;
Juergen Steinbrenner, Noetsch, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/02115 (2013.01); H01L 21/02527 (2013.01); H01L 21/02606 (2013.01); H01L 21/28568 (2013.01); H01L 21/31138 (2013.01); H01L 21/76801 (2013.01); H01L 21/76829 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 21/76885 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01); H01L 23/53223 (2013.01); H01L 23/53228 (2013.01); H01L 23/53266 (2013.01); H01L 21/02645 (2013.01); H01L 21/7682 (2013.01); H01L 2221/1047 (2013.01); H01L 2924/0002 (2013.01);
Abstract
In various embodiments a method for manufacturing a metallization layer on a substrate is provided, wherein the method may include forming a plurality of groups of nanotubes over a substrate, wherein the groups of nanotubes may be arranged such that a portion of the substrate is exposed and forming metal over the exposed portion of the substrate between the plurality of groups of nanotubes.