The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Feb. 21, 2017
Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;
Yuichiro Kitajima, Chiba, JP;
ABLIC Inc., , JP;
Abstract
Provided is a semiconductor device in which a fuse element, which is cuttable by a laser, can be stably cut. The fuse element includes an upper fuse element, a lower fuse wiring line, and a fuse connecting contact such that, in cutting the fuse element by a laser, the lower fuse wiring line is protected by an inter-layer film, and only the upper fuse element is efficiently melted and evaporated. In addition, the contact for connecting the upper fuse element and the lower fuse wiring line to each other is formed at a center of a laser irradiation region, and hence the connection portion receives the energy of the laser most efficiently.