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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10043680 B1

PDFFull Text
Date of Patent:
Aug. 07, 2018

Filed:

May. 14, 2014

Method for manufacturing semiconductor device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Ken Sakamoto, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Michael Lebentritt

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/4825 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/3735 (2013.01); H01L 23/3737 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49551 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

It is an object to provide a method for manufacturing a semiconductor device which can reduce degradation in package strength and a manufacturing cost, and promote miniaturization of a package. A method for manufacturing a semiconductor device includes steps of (a) preparing a lead frame having a die pad on which a semiconductor element is mounted, (b) placing a first resin which is granular in a mold, (c) placing the lead frame in the mold in such a manner that the first resin comes into contact with a lower side of the die pad, (d) filling the mold with a second resin on an upper side of the first resin in the mold, and (e) curing the first resin and the second resin, to mold the first resin and the second resin.

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