The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Jul. 27, 2012
Applicants:

Jin Kawakita, Tsukuba, JP;

Toyohiro Chikyo, Tsukuba, JP;

Inventors:

Jin Kawakita, Tsukuba, JP;

Toyohiro Chikyo, Tsukuba, JP;

Assignee:

NATIONAL INSTITUTE FOR MATERIALS SCIENCE, Tsukuba-Shi, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/12 (2006.01); C08G 61/12 (2006.01); C08G 73/02 (2006.01); H01L 51/00 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); C08K 3/08 (2006.01); H01L 51/42 (2006.01);
U.S. Cl.
CPC ...
H01B 1/124 (2013.01); C08G 61/124 (2013.01); C08G 61/126 (2013.01); C08G 73/0266 (2013.01); C08K 3/08 (2013.01); H01B 1/127 (2013.01); H01B 1/128 (2013.01); H01L 51/0027 (2013.01); H05K 1/092 (2013.01); H05K 3/106 (2013.01); C08G 2261/3221 (2013.01); C08G 2261/3223 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/011 (2013.01); H01L 51/0036 (2013.01); H01L 51/0091 (2013.01); H01L 51/4213 (2013.01); H05K 2201/0329 (2013.01); H05K 2201/10143 (2013.01); H05K 2203/1157 (2013.01); Y10T 428/2927 (2015.01); Y10T 428/2958 (2015.01);
Abstract

A process of producing a conducting material suitable for being filled in TSVs for LSI chip 3D package, etc. includes that a solution containing a monomer that provides a conducting polymer, anions, and metal ions such as Agor Cuis irradiated with ultraviolet radiation or light having the energy necessary for exciting electrons up to an energy level capable of reducing the metal ions to precipitate a conducting polymer/metal composite. This enables an electrical conductor of high electrical conductivity to be precipitated faster than could be achieved by conventional processes.


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