The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Jul. 06, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tooru Wada, Osaka, JP;

Shigeaki Sakatani, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 7/00 (2006.01); G02B 5/02 (2006.01); C01B 33/143 (2006.01); C01B 33/154 (2006.01); C01B 33/16 (2006.01); D06M 11/79 (2006.01); H05K 1/02 (2006.01); B32B 5/02 (2006.01); B32B 5/22 (2006.01); C01B 33/152 (2006.01); C01B 33/158 (2006.01); C01B 33/159 (2006.01);
U.S. Cl.
CPC ...
G02B 5/0273 (2013.01); B32B 5/022 (2013.01); B32B 5/22 (2013.01); C01B 33/1435 (2013.01); C01B 33/152 (2013.01); C01B 33/158 (2013.01); C01B 33/159 (2013.01); C01B 33/1546 (2013.01); C01B 33/16 (2013.01); D06M 11/79 (2013.01); G02B 5/021 (2013.01); H05K 1/0201 (2013.01); B32B 2250/02 (2013.01); B32B 2250/03 (2013.01); B32B 2255/02 (2013.01); B32B 2255/20 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2262/108 (2013.01); B32B 2264/102 (2013.01); B32B 2307/304 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); D06M 2400/02 (2013.01); H05K 2201/062 (2013.01);
Abstract

A heat-insulation material does not cause deterioration in heat-insulation performance and any loss of components included therein, and possesses an excellent radiation-preventing function. The heat-insulation material includes: a first heat-insulation layer that includes a first silica xerogel and a first radiation-preventing material; and a third heat-insulation layer that includes a third silica xerogel and second fibers, wherein the first heat-insulation layer and the third heat-insulation layer are layered. An electronic device includes the heat-insulation material. Yet further disclosed is a method for producing the heat-insulation material.


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