The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Sep. 24, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Kanechika Kiyose, Nagano, JP;

Hiroshi Matsuda, Gifu, JP;

Daisuke Nakanishi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); G01S 7/52 (2006.01); H01L 41/08 (2006.01); G01S 15/89 (2006.01); A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
G01S 7/52017 (2013.01); A61B 8/4494 (2013.01); B06B 1/0629 (2013.01); G01S 15/8925 (2013.01); H01L 41/0825 (2013.01);
Abstract

An ultrasonic device includes a base in which a base layer of a vibrating film is formed in every opening that is disposed in an array; an interconnect layer, which is a conductor, formed on the base layer; an insulating film that is formed on the interconnect layer, and forms a laminated structure with respect to the base layer; a plurality of piezoelectric elements that are separated from the interconnect layer by the insulating film, the piezoelectric elements each including a first electrode and a second electrode that sandwich a piezoelectric film on the insulating film; and a through conductor that passes through the insulating film, and connects at least one of the first electrode and the second electrode to the conductor constituting the interconnect layer.


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