The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Jul. 05, 2016
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Masatoshi Ueno, Hiroshima, JP;

Masahiro Nishikawa, Osaka, JP;

Hiro Aoki, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60Q 1/00 (2006.01); F21S 8/10 (2006.01); F21S 41/19 (2018.01); F21S 41/147 (2018.01); F21S 41/39 (2018.01); F21S 45/49 (2018.01); F21S 45/47 (2018.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21S 48/328 (2013.01); B60Q 1/0094 (2013.01); F21S 41/147 (2018.01); F21S 41/192 (2018.01); F21S 41/39 (2018.01); F21S 45/47 (2018.01); F21S 45/49 (2018.01); F21Y 2115/10 (2016.08);
Abstract

The light source unit includes: a semiconductor light emitting element; a lighting circuit configured to operate the semiconductor light emitting element; a first heat dissipation plate on which the semiconductor light emitting element is placed; a second heat dissipation plate on which the lighting circuit is placed; a wiring member electrically interconnecting the semiconductor light emitting element and the lighting circuit; and an interconnection member to which the first heat dissipation plate and the second heat dissipation plate are attached. The interconnection member is lower in thermal conductivity than the first heat dissipation plate and the second heat dissipation plate.


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