The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Aug. 04, 2016
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Cheolkyu Yang, Suwon-si, KR;
Young-Jin Noh, Suwon-si, KR;
Chulyoung Jang, Hwaseong-si, KR;
Joongyun Ra, Seoul, KR;
Dong-min Son, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
Provided are a dummy wafer, a thin-film forming method, and a method of fabricating a semiconductor device using the same. The dummy wafer includes an insulating substrate with a first surface opposite a second surface, and a plurality of openings formed in the insulating substrate. The plurality of openings penetrate at least a portion of the insulating substrate in a direction from the first surface toward the second surface. The first and second surfaces of the insulating substrate, and an inner surface of each of the plurality of openings, include protrusions.