The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Jul. 10, 2012
Tomoyuki Hirayama, Shizuoka, JP;
Pizhi Zhao, Shizuoka, JP;
Takeshi Handa, Shizuoka, JP;
Toshiya Anami, Shizuoka, JP;
Yusuke Nagaishi, Sagamihara, JP;
Koji Itakura, Fujisawa, JP;
Hirokazu Miyagawa, Fujisawa, JP;
Tsutomu Hattori, Atsugi, JP;
Shigenori Yoshizawa, Zama, JP;
Akio Yoshizawa, Tochigi, JP;
Tomoyuki Hirayama, Shizuoka, JP;
Pizhi Zhao, Shizuoka, JP;
Takeshi Handa, Shizuoka, JP;
Toshiya Anami, Shizuoka, JP;
Yusuke Nagaishi, Sagamihara, JP;
Koji Itakura, Fujisawa, JP;
Hirokazu Miyagawa, Fujisawa, JP;
Tsutomu Hattori, Atsugi, JP;
Shigenori Yoshizawa, Zama, JP;
Akio Yoshizawa, Tochigi, JP;
NIPPON LIGHT METAL COMPANY, LTD., Tokyo, JP;
NISSAN MOTOR CO., LTD., Yokohama-shi, JP;
Abstract
An aluminum alloy sheet includes an aluminum alloy substrate having a composition containing, by mass percentage, 3.0 to 4.0% of magnesium, 0.2 to 0.4% of manganese, 0.1 to 0.5% of iron, not less than 0.03% but less than 0.10% of copper, and less than 0.20% of silicon, with the remainder being aluminum and unavoidable impurities. A peak concentration of a copper concentration distribution in a thickness direction in a region at a depth of 15 nm to 200 nm from the surface of the aluminum alloy substrate is equal to or more than 0.15%, and the aluminum alloy substrate has a recrystallized structure with an average grain size of 15 μm or less.