The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Jul. 23, 2012
Applicants:

Hiromi Yokota, Aichi, JP;

Daisuke Yoshitome, Aichi, JP;

Inventors:

Hiromi Yokota, Aichi, JP;

Daisuke Yoshitome, Aichi, JP;

Assignee:

TAIHO KOGYO CO., LTD., Toyota-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22C 32/00 (2006.01); C22C 9/02 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); C22C 9/02 (2013.01); C22C 32/0089 (2013.01); F16C 2204/12 (2013.01);
Abstract

When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.


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