The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Jan. 28, 2016
Applicant:

Tesa SE, Norderstedt, DE;

Inventors:

Thorsten Krawinkel, Hamburg, DE;

Andreas Junghans, Hamburg, DE;

Assignee:

TESA SE, Norderstedt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2006.01); C09J 7/02 (2006.01); B32B 5/04 (2006.01); B32B 43/00 (2006.01); C09J 7/38 (2018.01); C09J 7/26 (2018.01); C09J 7/29 (2018.01); C09J 153/02 (2006.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0221 (2013.01); B32B 5/04 (2013.01); B32B 43/006 (2013.01); C09J 7/26 (2018.01); C09J 7/29 (2018.01); C09J 7/381 (2018.01); C09J 7/387 (2018.01); C09J 153/02 (2013.01); C09J 183/04 (2013.01); C09J 2201/134 (2013.01); C09J 2201/162 (2013.01); C09J 2201/606 (2013.01); C09J 2201/61 (2013.01); C09J 2201/618 (2013.01); C09J 2400/243 (2013.01); C09J 2423/105 (2013.01); C09J 2453/00 (2013.01); C09J 2467/006 (2013.01); C09J 2483/00 (2013.01); Y10T 156/1142 (2015.01); Y10T 428/249983 (2015.04); Y10T 428/2848 (2015.01);
Abstract

A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.


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