The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Oct. 29, 2014
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Daryl E Anderson, Corvallis, OR (US);
George H Corrigan, Albany, OR (US);
Scott A Linn, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); B41J 2/155 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/0458 (2013.01); B41J 2/14072 (2013.01); B41J 2/14112 (2013.01); B41J 2/155 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/13 (2013.01);
Abstract
A wide array printhead module includes a plurality of printhead die. Each of the printhead die includes a number of sensors to measure properties of a number of elements associated with the printhead die. The wide array printhead module further includes an application specific integrated circuit (ASIC) to command and control each of the printhead die. The ASIC is located off any of the printhead die.