The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

May. 20, 2014
Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Masao Kurosaki, Tokyo, JP;

Jun Maki, Tokyo, JP;

Shintaro Yamanaka, Tokyo, JP;

Hiroyuki Tanaka, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); C21D 1/84 (2006.01); C21D 6/00 (2006.01); C21D 1/26 (2006.01); C22C 18/00 (2006.01); C23C 2/06 (2006.01); C23C 2/28 (2006.01); C23C 2/26 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01); C23C 2/04 (2006.01); C23C 2/02 (2006.01); C23C 2/40 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01);
U.S. Cl.
CPC ...
B32B 15/013 (2013.01); C21D 1/26 (2013.01); C21D 1/84 (2013.01); C21D 6/00 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 18/00 (2013.01); C23C 2/02 (2013.01); C23C 2/04 (2013.01); C23C 2/06 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/40 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12924 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01);
Abstract

A galvannealed steel sheet includes a plating layer containing 7.2-10.6 mass % of Fe, 0.2-0.4 mass % of Al, and 0.1 mass % or more of at least one of Ni, Co, Cu, and In, and the balance of Zn and impurities. In a vertical cross-section of the plating layer, an average thickness of a ζ phase is 0.2 μm or less, and an average thickness of a Γ phase is 0.5 μm or less. In the Γ phase, at least one of Ni, Co, Cu, and In are contained at a ratio in the Γ phase of 0.5 mass % or more. A phase existing in contact with the Γ phase is a mixed phase of Γphase and δ phase, and a δ phase percentage defined by '(δ phase/Γ phase contact interface length)/(δ phase/Γ phase contact interface length+Γphase/Γ phase contact interface length)×100' is 10% or more.


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