The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Apr. 14, 2016
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Chu-heng Liu, Penfield, NY (US);

Paul J. McConville, Webster, NY (US);

Jason M. LeFevre, Penfield, NY (US);

James A. Winters, Alfred Station, NY (US);

Erwin Ruiz, Rochester, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/02 (2006.01); B29C 67/00 (2017.01); G03G 15/00 (2006.01); B29K 105/00 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/00 (2015.01); B29K 77/00 (2006.01); B29K 25/00 (2006.01);
U.S. Cl.
CPC ...
B29C 67/0074 (2013.01); B29C 65/02 (2013.01); B29C 67/0092 (2013.01); G03G 15/00 (2013.01); B29K 2025/06 (2013.01); B29K 2077/00 (2013.01); B29K 2105/251 (2013.01); B29K 2105/256 (2013.01); B29K 2825/06 (2013.01); B29K 2877/00 (2013.01); B29K 2995/001 (2013.01); B29K 2995/0059 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12);
Abstract

In 3-D printing a platen moves toward an intermediate transfer belt (ITB) to have a sheet positioned on the platen contact the ITB to electrostatically transfer a layer of different materials to the sheet, and then the platen moves to a stabilization station to join the layer to the sheet. This processing is repeated to have the sheet repeatedly contact the ITB (with intervening stabilization at the stabilization station) to successively form layers of the materials on the sheet. The freestanding stack is fed to a platform to successively form a 3-D structure of freestanding stacks of the layers. Heat and/or pressure and/or light are applied to the 3-D structure to bond the freestanding stacks to one another through the sheets of collapsible media on the platform.


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