The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 2018

Filed:

Apr. 06, 2016
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventor:

Yoshiki Sakazaki, Ashigarakami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/38 (2006.01); B29C 65/00 (2006.01); A61J 1/10 (2006.01); B29C 65/18 (2006.01); B29C 65/50 (2006.01); B32B 3/06 (2006.01); B32B 7/04 (2006.01); B32B 27/08 (2006.01); B29C 65/78 (2006.01); B29L 31/00 (2006.01); B29C 65/30 (2006.01); B29C 65/48 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/00141 (2013.01); A61J 1/10 (2013.01); B29C 65/18 (2013.01); B29C 65/5057 (2013.01); B29C 65/7808 (2013.01); B29C 65/7811 (2013.01); B29C 65/7841 (2013.01); B29C 65/7855 (2013.01); B29C 66/1122 (2013.01); B29C 66/43 (2013.01); B29C 66/5326 (2013.01); B29C 66/72321 (2013.01); B29C 66/72325 (2013.01); B29C 66/72341 (2013.01); B29C 66/72343 (2013.01); B29C 66/73186 (2013.01); B29C 66/8322 (2013.01); B29C 66/8432 (2013.01); B29C 66/8511 (2013.01); B32B 3/06 (2013.01); B32B 7/04 (2013.01); B32B 27/08 (2013.01); B29C 65/305 (2013.01); B29C 65/4815 (2013.01); B29C 65/4835 (2013.01); B29C 65/7817 (2013.01); B29C 65/7832 (2013.01); B29K 2995/0067 (2013.01); B29L 2009/00 (2013.01); B29L 2031/7128 (2013.01); B29L 2031/7148 (2013.01); B29L 2031/737 (2013.01); B29L 2031/753 (2013.01); B32B 2307/31 (2013.01); B32B 2307/7242 (2013.01); B32B 2439/46 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01); Y10T 156/103 (2015.01); Y10T 156/107 (2015.01); Y10T 156/1052 (2015.01); Y10T 156/1093 (2015.01); Y10T 156/1304 (2015.01); Y10T 156/1746 (2015.01);
Abstract

A sheet bonding device includes a pressurization mold which is constituted of an upper mold and a lower mold and performs sealing through heating by sandwiching a sealing target portion of a bag main body and a sealing target portion of a gas barrier function sheet with pressurization surfaces; a plurality of support pins which are provided in the lower mold so as to be retractable and position the gas barrier function sheet with respect to one surface of the bag main body by penetrating the sealing target portions of the bag main body and the gas barrier function sheet; and gas spray means for making the gas barrier function sheet float by spraying inert gas to an area-enlarged portion, which does not overlap the bag main body, of the gas barrier function sheet supported by the support pins.


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